Relife RL-044 0.12mm Tin Planting Stencils for iPhone 7 to 13 CPU / Baseband / WiFi / NFC / BGA Repair

Relife RL-044 0.12mm Tin Planting Stencils for iPhone 7 to 13 CPU/Baseband/WiFi/NFC /BGA Repair

Features:

• Suitable for iPhone 7 to 13 CPU/baseband/WI-FI/NFC/BGA, etc.

• Ultra-thin design, better fit with tin planting, continuous bending, and full toughness

• Quick heat dissipation to avoid excessive temperature and damage t,o components

• Round and square precise hole position makes the tin ball more rounded and prevents the mesh from jamming the tin ball

Specification:

• Brand: RELIFE 

• Name: Precision BGA stencils

• MODEL: RL-044 

• Net Weight: About 5g 

• Gross Weight: About 30g 

• Product Size: 80*100*0.12mm 

• Thickness: 0.12mm 

• Package Size: 145*100*10mm 

• Material: High-quality special steel 

Package includes:

• 1 x BGA stencil