WL High-Quality 4 in 1 NAND Baseband CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballing Stencil with Fixed Plate for iPhone 6 6Plus

$24.50
In stock
SKU
MV102269
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Description

WL High-Quality 4 in 1 NAND, Baseband, A8 CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballing Stencil for iPhone 6 6Plus
With Fixed Plate, Easy to use and more accurate IC welding position

Package include:
1 x Steel Net
1 x Fixed Plate

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You're reviewing:WL High-Quality 4 in 1 NAND Baseband CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballing Stencil with Fixed Plate for iPhone 6 6Plus