Amaoe 0.15 mm Full Set – EMMC / EMCP / UFS Reballing Stencil for BGA153, BGA162, BGA169, BGA186, BGA221, BGA254 with Tin‑Steel Net, Fixed Plate & Holder

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Product details
Description
0.15MM Full Set Reballing Stencil Kit for EMMC/EMCP/UFS (BGA153, BGA162, BGA169, BGA186, BGA221, BGA254)
Key Features:
• Adjustable steel frame – swap stencils quickly for different chip models and capacities
• Fixed plate & holder – ensures precise IC placement and stable welding
• 0.15 mm tin‑plating – optimal solder flow and reliable reballing
• Cost‑effective – reduces waste and eliminates the need for multiple dedicated tools
Product Highlights:
Supports a wide range of EMMC, EMCP and UFS BGA packages (BGA153‑BGA254). The varying font thicknesses are accommodated by the adjustable steel components, allowing you to change stencils effortlessly and achieve consistent results.
Package Includes:
6 × Steel Net
1 × Fixed Plate
1 × Holder
2 × Adjustable Steel Frames
2 × Adjustable Steel Sheets










