2uFix Degumming Repairing Bent Blade Set for Mobile Phone Screen Debonding / Removal IC

2uFix Degumming Repairing Bent Blade Set for Mobile Phone Screen Debonding/Removal IC

Features:

• Independent pull-out stainless steel storage box, exquisite and compact, easy to store, and easy to use

• Double-sided uniform trimming, utility model patented technology

• The blade is from thin to thick, and the force is more uniform

• It is suitable for removing glue from the screen, and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc

• Upgraded to a more practical bent-blade design, by bending the blade, the loss to the motherboard, chip, screen, etc is realized and reduced, thereby improving the yield

• Nano-coating is anti-rust, the blade body is flexible, thin, and elastic, the thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm

Package includes:

• 7 x Blades