2uul BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad for BGA Hard Disk CPU IC Repair
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Seller: Martview Shenzhen
ID: MV-250624M41YT5
Weight: 0.08 kg
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| 3 | NaN | -2.9% |
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Product details
Description
2uul BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad for BGA Hard Disk CPU IC Repair
Features:
- Baby rubber magnetic tin pad, soft silicone material, with strong magnetic adsorption, high temperature resistance, and easy-to-clean
- Very soft, silicone material, high-temperature resistance, easy to clean
- Strong magnetic adsorption design, so that the steel mesh is not easily fall and shift, planting tin is stronger and more stable
- Plant tin heat dissipation drum, the design of hollow heat dissipation hole on the back planting tin mesh planting tin cooling effect is good steel mesh planting tin does not bulge
- High temperature resistant soft silicone, can withstand high temperatures up to 500℃, has adhesion, can play an anti-slip effect
Package includes:
- 1 x Silicone Pad
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