2uul PB01 / PB02 PadBall Solder Balls for iPhone / Android Solder Pad Rework - 100K
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Seller: Martview Shenzhen
ID: MV-250521487DY3
Weight: 0.20 kg
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| 3 | NaN | -3.1% |
| 5 | NaN | -4.6% |
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PB01+PB02/for Apple&AndroidProduct details
Description
2uul PB01 / PB02 PadBall Solder Balls for iPhone / Android Solder Pad Rework - 100K
Features:
- Sn63/Pb37 Alloy: Reliable eutectic composition (183°C melting point) for smooth reflow and strong joints.
- Dual Compatibility: Ideal for both iPhone and Android device repairs (PB01 for Apple/PB02 for Android)
- Precision Sizing: Uniform diameters (0.2mm/0.3mm/0.45mm/0.6mm/0.76mm) for BGA/CSP pad restoration.
- High Purity: Low oxidation with minimal residue, reducing bridging risks.
- Bulk Quantity: 100K balls per bottle (30g net weight) for cost-effective repairs
- Each bottle contains 100,000 precision-sized solder beads (0.2~0.76mm) to meet demanding micro-soldering applications
Specification:
- Material: Sn63/Pb37 (Tin 63%/Lead 37%)
- Size Options: 0.2mm, 0.3mm, 0.45mm, 0.6mm, 0.76mm
- Package: Sealed anti-static bottle (131*105*48mm)
- Net Weight: 5.5g (iPhone) / 7.2g (Android)
- Applications: Restore damaged pads on iPhone/Android mainboards; Reballing GPU, CPU, or chipset components; Precision PCB repairs under microscope
Packaeg includes:
- 100000 x Solder Balls
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