80mm / 90mm Universal BGA Reballing Tin-plating Platform with Universal / CPU / DDR Stencils

80mm / 90mm Universal BGA Reballing Tin-plating Platform with Universal / CPU / DDR Stencils

Features:

• Featuring an alloy aluminium frame, the structure is lightweight yet durable.

• This model is equipped with an automatic centring function; by rotating the spiral disc, the four clamping blocks secure the chip simultaneously, eliminating the need for individual adjustments. It offers precise positioning, rapid mounting and high ball placement efficiency.

• A single ball placement station, when used in conjunction with different ball placement stencils, can accommodate BGA ball placement for various sizes. Compatible with both 80×80 mm and 90×90 mm stencils, it offers high productivity and broad applicability.

• The turntable design makes adjusting for chips of different sizes simpler and more convenient, thereby improving work efficiency.

• The adjustable slider design ingeniously supports the secure holding of rectangular chips.

• By manually turning the copper pillar screws at the four corners, the height of the stencil can be adjusted.

Package includes:

• 1 x According to your choice