90x90mm Diagonal BGA Ball Mounting Table for Chip Rework Repair

90*90mm Diagonal BGA Ball Mounting Table for Chip Rework Repair
For manual BGA ball mounting, it is suitable for rework of BGA packaged chips, such as mobile phones, digital cameras, graphics card BGA, notebook computers, PDAs, etc., low-cost BGA rework system

Features:

• This product is a diagonally adjustable bead planting table, which can be operated with one hand for alignment and to adjust the size of the chip holder with one hand.

• This product adopts alloy aluminum structure, light and durable structure, precise oil-bearing guide, accurate positioning

• A bead planting table can be used together with different bead planting steel meshes, which can correspond to different sizes of BGA ball planting

• (Minimum adaptation 10MM10MM. Maximum 48MM*48MM) High productivity and wide applicability

• Can be equipped with 90*90MM steel mesh, and can also be used with direct heating steel mesh, which is convenient and fast

• Bead planting table size: 90*90mm/80*80mm optional

Package A includes:

• 1 x Silver Diagonal Plant Stand

• 10 x 90 Universal steel mesh

Package B includes:

• 1 x Handle Planter Table

• 1 x Soldering Wire

• 2 x ESD tweezers

• 2 x ESD brushes

• 1 x High-Temperature Tape

• 1 x ES Mini Suction Pen

• 1 x Stainless Steel Scraper

• 10 x Universal Stencil

• 1 x 6-in-1 Flux Tool

Package C includes:

• 1 x diagonal plant stand

• 1 x Soldering Wire

• 2 x ESD brushes

• 2 x ESD silver

• 1 x High-Temperature Tape

• 1 x ESD vacuum suction pen

• 1 x Stainless Steel Scraper

• 9 x 25k leaded solder balls

• 10 x Universal Stencil

• 1 x 6-in-1 Flux Tool

• 1 x Original Box