Alpha POP707 / UP78 10g Soldering Paste for Mobile Phone BGA PCB Repair
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Seller: Martview Shenzhen
ID: MV-250626KX8XA6
Weight: 0.05 kg
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| 3 | NaN | -3.1% |
| 5 | NaN | -4.6% |
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POP707
UP78Product details
Description
Alpha POP707 / UP78 10g Soldering Paste for Mobile Phone BGA PCB Repair
Specification:
POP707:
- Specification: 10g per piece
UP78:
- Features: BGA that can be used for stacked packaging, with excellent printing, spot welding, and wetting properties, forming a uniform distribution on the surface of the sphere.
- Specification: 10g per piece
- Features: UP78 is used for repair and welding, and can be used for OSP protective copper pads, which are organic solder mask films that prevent bare copper from forming. It has anti oxidation, impact resistance, moisture resistance, etc
Package includes:
- 1 x Soldering Paste
Noted:
Due to FedEx DHL can not send out the parcel that comes with Liquid, so we just can send out it by Singapore Post - Standard Mail or Registered Mail. If your order has other products, we will take out this to send by Singapore Post - Standard Mail or Registered Mail, and other products will send out by the courier which you choose. Thanks for understanding.
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