Amaoe 0.12mm A20 Pro Lower Layer (CPU) BGA Reballing Stencil Tin Plating Platform Set for iPhone 18P / 18PM / Duo
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Seller: Martview Shenzhen
ID: MV-2610193C6L2E
Weight: 0.27 kg
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only Standard Edition Stencilonly Carve Through Edition Stencilonly Positioning Plateonly BaseFull Set/with Standard Edition StencilFull Set/with Carve Through Edition StencilProduct details
Description
Amaoe 0.12mm A20 Pro Lower Layer (CPU) BGA Reballing Stencil Tin Plating Platform Set for iPhone 18P/ 18PM / Duo
Package includes:
- 2 x Tin Scraping Blade
- 1 x Positioning Plate
- 1 x Magnetic Base
- 1 x Stencil
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