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Amaoe 0.12mm Middle Layer-CPU Board BGA Reballing Stencil Platform Set for Samsung Galaxy S25 Edge S937B / U

amaoe 012mm-middle-layer-cpu-board-bga-reballing-stencil-platform-set-for-samsung-galaxy-s25-edge-s9
amaoe 012mm-middle-layer-cpu-board-bga-reballing-stencil-platform-set-for-samsung-galaxy-s25-edge-s9
amaoe 012mm-middle-layer-cpu-board-bga-reballing-stencil-platform-set-for-samsung-galaxy-s25-edge-s9
amaoe 012mm-middle-layer-cpu-board-bga-reballing-stencil-platform-set-for-samsung-galaxy-s25-edge-s9
b-s4
amaoe 012mm-middle-layer-cpu-board-bga-reballing-stencil-platform-set-for-samsung-galaxy-s25-edge-s9

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ID: MV-260917UAN9F5
Weight: 0.27 kg
QtyPriceDiscount
1
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-3.0%
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-5.2%
10
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-8.9%

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Description

Amaoe 0.12mm Middle Layer-CPU Board BGA Reballing Stencil Platform Set for Samsung Galaxy S25 Edge S937B / U

Package includes:
  • 1 x Positioning Plate
  • 1 x Magnet Base
  • 1 x Stencil
  • 2 x Blade
amaoe 012mm-middle-layer-cpu-board-bga-reballing-stencil-platform-set-for-samsung-galaxy-s25-edge-s9
amaoe 012mm-middle-layer-cpu-board-bga-reballing-stencil-platform-set-for-samsung-galaxy-s25-edge-s9
amaoe 012mm-middle-layer-cpu-board-bga-reballing-stencil-platform-set-for-samsung-galaxy-s25-edge-s9
b-s4
amaoe 012mm-middle-layer-cpu-board-bga-reballing-stencil-platform-set-for-samsung-galaxy-s25-edge-s9

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