Amaoe 0.12mm Middle Layer-CPU Board BGA Reballing Stencil Tin Plating Platform Set for Samsung S26 SM-942U / W / 0 / D
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Seller: Martview Shenzhen
ID: MV-261104Y7P2C5
Weight: 0.27 kg
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| 3 | NaN | -3.0% |
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only Middle Layer Stencilonly Positioning Plateonly BaseFull SetProduct details
Description
Amaoe 0.12mm Middle Layer-CPU Board BGA Reballing Stencil Tin Plating Platform Set for Samsung S26 SM-942U/W/0/D
Package includes:
- 2 x Tin Scraping Blade
- 1 x Positioning Plate
- 1 x Magnetic Base
- 1 x Stencil
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