Amaoe 0.30mm Qualcomm SA8775P In-Vehicle Mainboard Chips BGA Reballing Stencil Tin Plating Platform Set
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Seller: Martview Shenzhen
ID: MV-260819E432M3
Weight: 0.27 kg
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Description
Amaoe 0.30mm Qualcomm SA8775P In-Vehicle Mainboard Chips BGA Reballing Stencil Tin Plating Platform Set
Package includes:
- 2 x Tin Scraping Blades
- 1 x Positioning Plate
- 1 x Magnetic Base
- 1 x Stencil
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