Amaoe BGA Reballing Stencil Motherboard Middle Layer Tin Planting Steel Mesh for HUAWEI P50 Pro
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Seller: Martview Shenzhen
ID: MV-211023EJB264
Weight: 0.40 kg
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| 3 | NaN | -3.0% |
| 5 | NaN | -5.2% |
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Product details
Description
Amaoe BGA Reballing Stencil Motherboard Middle Layer Tin Planting Steel Mesh for HUAWEI P50 Pro
Package includes:
- 1 x Tin Planting Steel/Set
Customer reviews
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