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Amaoe MFix-14 Series Mbga Motherboard Middle Layer BGA Reballing Platform for iPhone 14 Series

amaoe mfix-14-series-mbga-motherboard-middle-layer-bga-reballing-platform-for-iphone-14-series-13

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ID: MV-23021571FCZ7
Weight: 0.15 kg
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MFix-14 Series/for iPhone 14 SeriesMFix-14 Series/for iPhone 14 SeriesMFix-14/14PlusMFix-14/14PlusMFix-14P/14PMMFix-14P/14PMonly Fixture for iPhone 14/14Plusonly Fixture for iPhone 14/14Plusonly Fixture for iPhone 14Pro/14Pro Maxonly Fixture for iPhone 14Pro/14Pro Max

Product details

Description

Amaoe MFix-14 Series Mbga Motherboard Middle Layer BGA Reballing Platform for iPhone 14 Series

Features:
  • Motherboard fixing and repair, middle layer tin planting, CPU and hard disk fixing and removing glue
  • For different motherboard structures, multi-dimensional alr avoidance eliminates the need to remove the adhesive and the fixing sheet to improve work efficiency
  • Height difference synthetic stone positioning clip to prevent pressure damage to copper sheets/cables
  • Modular design, split structure, each fixture can be operated independently for glue removal, which is more efficient to use
  • Ergonomic design for easy opening and closing of components and clamping of the motherboard
  • The positioning pin is inserted into the positioning hole, and the magnet is attached to the bottom screw, which can be quickly and easily fixed

Package includes:
  • 2 x Tin scraping blade
  • 1 x Gaskets
  • 2 x Fixture
  • 1 x Magnetic base
  • 2 x Stencil
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