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Amaoe MFix-15 Series Mbga Motherboard Middle Layer BGA Reballing Platform for iPhone 15 Series

amaoe mfix-15-series-mbga-motherboard-middle-layer-bga-reballing-platform

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ID: MV-231208257745
Weight: 0.55 kg
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Product details

Description

Amaoe MFix-15 Series Mbga Motherboard Middle Layer BGA Reballing Platform for iPhone 15 Series

Features:
  • Motherboard fixing and repair, middle layer tin planting, CPU and hard disk fixing and removing glue
  • For different motherboard structures, multi-dimensional alr avoidance eliminates the need to remove the adhesive and the fixing sheet to improve work efficiency
  • Height difference synthetic stone positioning clip to prevent pressure damage to copper sheets/cables
  • Modular design, split structure, each fixture can be operated independently for glue removal, which is more efficient to use
  • Ergonomic design for easy opening and closing of components and clamping of the motherboard
  • The positioning pin is inserted into the positioning hole, and the magnet is attached to the bottom screw, which can be quickly and easily fixed

Package includes:
  • 2 x Tin scraping blade
  • 1 x Gaskets
  • 2 x Fixture
  • 1 x Magnetic base
  • 2 x Stencil
amaoe mfix-15-series-mbga-motherboard-middle-layer-bga-reballing-platform

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