Amaoe OFix-C Multi-functional Motherboard Repair Fixture for Chip Degumming and Tinning

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Description
Amaoe OFix-C Multi-functional Motherboard Repair Fixture for Chip Degumming and Tinning
Features:
- New design: Hidden screw, base separation, add adhesive removal module, buckle inner groove design, new cylindrical buckle design
- Synthetic stone material, high-temperature resistance, no heat transfer, anti-static
- New cylindrical buckle design, strong universality, suitable for fixing most irregular motherboards
- Magnetic assembly, reserved upgrade space for later release of new models to reduce purchasing costs
- Hidden screw prevents residue from falling into the screw, more durable and better to use
- 70mm large clamping length, suitable for most mobile phone motherboards
- Support parallel placement or 45° oblique placement, better compatibility
- The card motherboard does not pop out, does not card capacitors or resistors
- Three-stage step snap, total thickness 6.5mm, divided into: motherboard synthetic stone slot + chip metal chip slot
- Level 1 slot, 3mm deep, 0.5mm wide, for motherboard maintenance; Level 2 slot, 3mm deep, for IP X-16 series motherboards; Level 3 slot, 0.5mm deep, for chip de-gumming
Package includes:
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