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Amaoe QU8 0.12mm BGA Reballing Stencil for Qualcomm Snapdragon 888 SM8250 SDM439 SM8350

Amaoe QU8 0.12mm BGA Reballing Stencil for Qualcomm Snapdragon 888 SM8250 SDM439 SM8350
Amaoe QU8 0.12mm BGA Reballing Stencil for Qualcomm Snapdragon 888 SM8250 SDM439 SM8350

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ID: MV-220418225R33
Weight: 0.01 kg
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-8.6%

Product details

Description

Amaoe QU8 0.12mm BGA Reballing Stencil for Qualcomm Snapdragon 888 SM8250 SDM439 SM8350

Package includes:
  • 1 x Stencil
Amaoe QU8 0.12mm BGA Reballing Stencil for Qualcomm Snapdragon 888 SM8250 SDM439 SM8350

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