Amaoe U-GL1 0.12mm CPU-isolated Mixed BGA Reballing Stencil for Snapdragon / Kirin / Exynos
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Seller: Martview Shenzhen
ID: MV-260414W2WUD6
Weight: 0.02 kg
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| 3 | NaN | -2.9% |
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Product details
Description
Amaoe U-GL1 0.12mm CPU-isolated Mixed BGA Reballing Stencil for Snapdragon / Kirin / Exynos
Models include:
- Kirin 980-HI3680
- Snapdragon 778G-SM7315/7325
- Snapdragon 6Gen1-SM6450
- Snapdragon 888-SM8350
- Snapdragon 888-SM8350
- Exynos 1080
- Snapdragon 778G-SM7315/7325
- Kirin 980-HI3680
Package includes:
- 1 x Stencil
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