Amaoe U20 0.12mm BGA Reballing Stencil Platform Set for HiSilicon Hi3690 5G CPU Lower Layel
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Seller: Martview Shenzhen
ID: MV-2209178HA316
Weight: 0.30 kg
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| 3 | NaN | -3.0% |
| 5 | NaN | -5.2% |
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Product details
Description
Amaoe U20 0.12mm BGA Reballing Stencil Platform Set for HiSilicon Hi3690 5G CPU Lower Layel
Package includes:
- 1 x Positioning plate
- 1 x Magnet Base
- 1 x Steel mesh
- 2 x Blade
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