Amaoe U23 0.12mm CPU BGA Reballing Stencil Platform Set for Qualcomm Snapdragon 6Gen5 SM6850
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Seller: Martview Shenzhen
ID: MV-26091471FGW6
Weight: 0.27 kg
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| 3 | NaN | -3.0% |
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Description
Amaoe U23 0.12mm CPU BGA Reballing Stencil Platform Set for Qualcomm Snapdragon 6Gen5 SM6850
Package includes:
- 1 x Positioning plate
- 1 x Magnet Base
- 1 x Steel mesh
- 2 x Blade
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