Amaoe U25-SM8950 0.12mm CPU BGA Reballing Stencil Tin Plating Platform Set for Qualcomm SM8950 Snapdragon 8 Elite Gen 6
0 out of 5 stars
No review yetReady stock
NaN
As low as NaN
Worldwide shipping
Seller: Martview Shenzhen
ID: MV-261029N3SPUN
Weight: 0.27 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -3.0% |
| 5 | NaN | -5.2% |
| 10 | NaN | -8.9% |
Please select Type
Choose a Type
only Stencilonly Positioning Plateonly BaseFull SetProduct details
Description
Amaoe U25-SM8950 0.12mm CPU BGA Reballing Stencil Tin Plating Platform Set for Qualcomm SM8950 Snapdragon 8 Elite Gen 6
Package includes:
- 2 x Tin Scraping Blade
- 1 x Positioning Plate
- 1 x Magnetic Base
- 1 x Stencil
Customer reviews
0.0/ 5.0
0
0
0
0
0
