Amaoe U30 0.12mm CPU BGA Reballing Stencil Tin Plating Platform Set for HiSilicon Kirin9030 Hi36D0
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Seller: Martview Shenzhen
ID: MV-260127MJX9V6
Weight: 0.27 kg
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Description
Amaoe U30 0.12mm CPU BGA Reballing Stencil Tin Plating Platform Set for HiSilicon Kirin9030 Hi36D0
Package includes:
- 2 x Tin Scraping Blade
- 1 x Positioning Plate
- 1 x Magnetic Base
- 1 x Stencil
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