BST-084 3-in-1 Middle Layer Motherboard BGA Reballing Platform for iPhone 14 Full Series
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Seller: Martview Shenzhen
ID: MV-2305115N67TY
Weight: 0.40 kg
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Product details
Description
BST-084 3-in-1 Middle Layer Motherboard BGA Reballing Platform for iPhone 14 Full Series
Features:
- 3-in-1 Magnetic Flocking Platform for iPhone 14, 14 Plus, 14 Pro, 14Pro Max Middle Layer BGA Reballing Stencil
- The rounded square and precise hole position make the tin ball more rounded and prevents the mesh from jamming the tin ball
- There is a strong magnet embedded in the base, and strong magnetic adsorption, so that the positioning is accurate, does not deviate, and the magnetism does not change at high temperatures
- The steel stencil has strong toughness, high-temperature resistance, is not easily deformed and will not cause tin to form blocks, easy to remove
- Every tin ball is as round and full as a pearl, meeting the chip requirements
Package includes:
- 1 x BGA Reballing Platform
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