BST-QJ-1 High-Density Cleaning Sponge with Gripper for Mobile Phone Screen / Camera / PCB Soldering
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Seller: Martview Shenzhen
ID: MV-24071141MQX1
Weight: 0.20 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -3.1% |
| 5 | NaN | -4.7% |
| 10 | NaN | -7.0% |
Product details
Description
BST-QJ-1 High-Density Cleaning Sponge with Gripper for Mobile Phone Screen / Camera / PCB Soldering
Features:
- No floc or residue
- The adsorption force is stronger
- Can be used with a variety of cleaning agents
- 50 pieces/can, no additional cutting required
Package includes:
- 50 x Sponge
- 1 x Gripper
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