CPU BGA Chip Remove Tool – Glue Disassembly, Cleaning & Pry Knife for iPhone & Mobile Phone Motherboards
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Product details
Description
Description
CPU BGA Chip Remove Tool is a professional mobile‑phone repair kit designed for chip removal, rubber shovel handling, and UV‑glue disassembly cleaning.
Key Features:
- #1 – Precision knife for removing phone ICs and CPU baseband.
- #2 – Shovel‑type knife for extracting UV glue.
- #3 – Rubber shovel knife for UV glue removal.
- #4 – Separate rubber shovel knife for delicate glue work.
- #5 – Knife for cleaning glue in marginal areas.
- #6 – Knife for removing IC glue from edge locations.
- #7 – Knife for extracting ICs from the motherboard.
- #8 – Knife specialized for 6S power IC removal.
Package Includes
2 × Metal knife handles
8 × Knives
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