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eMMC100 Aging Burn-in Test Socket without Adaptor Plate for BGA100 to USB

emmc100 aging-burn-in-test-socket-without-adaptor-plate-for-bga100-to-usb-1

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12 x 18mm14 x 18mm

Product details

Description

eMMC100 Aging Burn-in Test Socket without Adaptor Plate for BGA100 to USB

Features:
  • Product use: Programming block, test block, test, read, and write to EMMC100 IC chips
  • Supports hot-plugging and individual switching of the power supply, supports testing via the USB interface or by connecting a cable to the corresponding PIN on the board
  • Floating board structure for precise positioning, easy access to ICs, and higher efficiency
  • Apply to eMMC of Samsung, Sandis k, Toshiba, Hynix, and Intel.
  • With 88pins and pin pitch 1.0mm, eMMC size 12x18mm, we also provide another type of size 14x18mm
  • Apply to eMMC thickness of 0.6mm to 2.0mm.
  • The test can be carried out with or without balls.
  • This product applies to BGA 100

Package includes:
  • 1 x Test Socket (without Adaptor Plate)
emmc100 aging-burn-in-test-socket-without-adaptor-plate-for-bga100-to-usb-1
emmc100 aging-burn-in-test-socket-without-adaptor-plate-for-bga100-to-usb-2
emmc100 aging-burn-in-test-socket-without-adaptor-plate-for-bga100-to-usb-3
emmc100 aging-burn-in-test-socket-without-adaptor-plate-for-bga100-to-usb-4

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