Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering
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Seller: Martview Shenzhen
ID: MV-250312J6JTAR
Weight: 1.10 kg
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| 3 | NaN | -2.9% |
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Product details
Description
Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering
Features:
- New heat-resistant silica pads say goodbye to messy desktops, a large working area, multi-section for organizing, no deformation under high heat
- High heat resistance up to 500℃, no deformation under high heat, protects the desk from heating, its heat resistance can function very well under up to 500℃ circumstances, no matter if a heat gun, iron, solder station, or other tools and equipment cause it
- Strong toughness, no deformation, curls freely, twists without deformation, good resilience, and convenient storage
- Effective waterproof and easy to maintain, stain resistant, easy to clean, keep the desktop tidy
Package includes:
- 1 x Silicone Pad
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