High-Quality Multi-Function BGA Reballing Positioning Fixture & Motherboard Cooling Soldering / Desoldering Platform for iPhone X
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Product details
Description
High Quality Multi-Function BGA Reballing Positioning Fixture for iPhone X Motherboard Cooling, Soldering & Desoldering
This versatile platform supports various iPhone CPU and NAND chip sockets for precise positioning, disassembly, soldering, and reballing. Its high‑temperature‑resistant cooling system provides professional‑grade assistance for iPhone motherboard repairs.
Key Features:
- Pure copper heat‑conduction block – prevents tin burst on the back IC by using a heat‑conduction sticker; the copper block never contacts the main board directly.
- Integrated CPU positioning structure – automatic alignment eliminates manual positioning and boosts success rates.
- Built‑in tin‑planting layer – precision stencils fabricated with world‑leading laser technology.
- Motherboard layer‑separation and positioning system – simplifies board separation, soldering, and installation.
- Precision positioning columns – ensure efficient repairs and accurate component placement.
- Special‑treated copper surface – retains a new‑like color and excellent conductivity.
- High‑temperature synthetic stone material – tested for 500 °C direct heating, offering durability without deformation.
Package Includes:
1 x Working Platform
1 x CPU Positioning Solder Net
1 x Positioning Mold Steel Plate
1 x Mainboard Protector
1 x NAND BGA Reballing Net
2 x Heat Sinks
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