i2C FA03 Second Generation iPhone 13 / 14 All Series Integration Face Chip

i2C FA03 Second Generation  iPhone 13/14 All Series Integration Face Chip

Features:

• Integrated pad with 183°C melting point pad, direct welding, save time and labor

• No welding gasket, no complicated operation, can be welded in 10 seconds

• Fixes problems that can't be typed, Face ID is not available, sensing problems, etc

• A1 pin identification, easy to identify the chip 1 pin

• Imported 16-pin special MCU, high stability

• Supports read and write checks on devices v8i, i6S

• Support 13/14 full series of models, strong versatility

Operating Tutorial(Support i6/i6S/Dot matrix repair instrument V8i):

• Before you perform this operation, back up data in the cloud
• Take out the cable from the lattice module
• Heating and taking out the original dot matrix chip, welding 13/14 series integrated face chip
• After the welding is completed, the cable is buckled on the equipment for testing and burning data that has been backed up

Package includes:

• 1 x Chip