i2C T30 Ceramic Heating Intelligent Desoldering Station for iPhone X to 17PM Motherboard Repair

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Seller: Martview Shenzhen
ID: MV-2609153549CR
Weight: 1.50 kg
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only T30 Intelligent Desoldering StationStandard Version/for X-17PMProfessional Version/for 14-17PM
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Product details
Description
i2C T30 Ceramic Heating Intelligent Desoldering Station for iPhone X to 17PM Motherboard Repair
Note:
- Dedicated Modules: Heat only the middle layer to avoid risks such as solder splatter and damage to the motherboard
- Universal Modules: Heat the entire board, which can easily lead to solder splatter and damage to the motherboard
Features:
- T30 Mid-layer Desoldering Station, dual ceramic heating elements, brand-new dual-ceramic MCH heating system, fully upgraded from single-element PTC to dual-ceramic MCH heating technology
- Faster heating, nearly double the efficiency, higher thermal efficiency, quicker temperature recovery, and more stable temperature control
- As the heating resistors are fully embedded within a dense ceramic matrix, the MCH heating elements do not oxidise during operation; they exhibit extremely low power decay and a long service life, thereby reducing the equipment’s long-term maintenance costs
- New heating module: heats only the middle layer locally, with a hollowed-out base; does not heat the entire board, ensuring safer layer-by-layer bonding without damaging the motherboard and preventing solder splatter
- Heats only the middle layer; the top and bottom surfaces remain unheated, eliminating concerns about solder splatter and preventing damage to hard drives and CPUs
- Specifically designed for desoldering the middle layer of Apple’s double-layer motherboards, precisely heating the middle-layer solder joints for safer, more efficient and more professional results
- 1.8-inch high-definition LCD screen displays key information such as temperature and operating status in real time, making every desoldering process more intuitive and efficient
- Equipped with built-in PCB positioning pins, the upper and lower layers automatically align during bonding, eliminating the need for manual alignment; the module features built-in latches for simple and convenient replacement
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