JTX BT1 Tin Dragging Needle Connector Reballing Solder Bar Set for BGA-Packaged Chip Solder Drag

0 out of 5 stars
No review yetReady stock
NaN
As low as NaN
Worldwide shipping
Seller: Martview Shenzhen
ID: MV-251014ZU37T9
Weight: 0.10 kg
Qty | Price | Discount |
---|---|---|
1 | NaN | |
3 | NaN | -3.1% |
5 | NaN | -4.6% |
10 | NaN | -6.9% |
Product details
Description
JTX BT1 Tin Dragging Needle Connector Reballing Solder Bar Set for BGA-Packaged Chip Solder Drag
Features:
- Exquisite craftsmanship, uniform/rapid, full and smooth tinning, pure copper with gold plating, quick tin absorption
- The needle tip is made of high-purity copper with gold plating, which increases the tinning speed by 50%
- The spherical tip design enables precise fitting to the edge of the pad, preventing scratches on the motherboard. It is particularly suitable for soldering wick operations on BGA packaged chips
- Designed specifically for mobile phone card holders and connectors. The ball tip can reach deep into gaps to quickly complete pad desoldering
- Alloy material with ESD protection: Prevents electrostatic damage to electronic components during precision motherboard repair
Package includes:
- 1 x Solder Bar
- 3 x Needle






Customer reviews
0.0/ 5.0
0
0
0
0
0