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JTX SM-01 Swap Board Chips BGA Reballing Stencil Platform Set for iPhone 8 to 16Pro Max

jtx sm-01-swap-board-chips-bga-reballing-stencil-platform-set-for-iphone-8-to-16pro-max-1

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ID: MV-25030518V8EN
Weight: 0.65 kg
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Product details

Description

JTX SM-01 Swap Board Chips BGA Reballing Stencil Platform Set for iPhone 8 to 16Pro Max

Features:
  • Super magnetic positioning reballing platform, high temperature resistant ultra-thin positioning plate, the absorption of tin mesh is stronger
  • Supports iPhone 8 to 16Pro Max, motherboard soldering upgraded in the future
  • Universal base, unlimited compatibility, one purchase, lasting use
  • Strong magnetic base, accurate positioning, strong magnetic clamping firm, automatic alignment, work more efficiently
  • Synthetic stone design green stone, high-temperature resistance, high strength, anti-fouling, easy to clean
  • Board swapping chips rapid positioning, integrated processing, faster and safer
  • Selected high-quality steel, fine workmanship, wear resistance, high toughness support tin planting
  • Square chamfered mesh design effectively prevents steel mesh bulge/tin ball, more round and full
  • The plant tin table is made of environmentally friendly rubber foot mat, which has the characteristics of wear-resistant, anti-slip, shock-absorbing and anti-pressure, anti-aging, non-toxic, tasteless, and high-temperature resistance

Package includes:
  • 1 x Base
  • 10 x Positioner Plate
  • 11 x Stencil
jtx sm-01-swap-board-chips-bga-reballing-stencil-platform-set-for-iphone-8-to-16pro-max-1
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jtx sm-01-swap-board-chips-bga-reballing-stencil-platform-set-for-iphone-8-to-16pro-max-5
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jtx sm-01-swap-board-chips-bga-reballing-stencil-platform-set-for-iphone-8-to-16pro-max-8
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