Kaisi 4-in-1 Middle Layer Motherboard BGA Reballing Stencil Platform for iPhone 13 Series
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Seller: Martview Shenzhen
ID: MV-220505PUW29V
Weight: 0.40 kg
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| 3 | NaN | -2.4% |
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Product details
Description
Kaisi 4-in-1 Middle Layer Motherboard BGA Reballing Stencil Platform for iPhone 13 Series
Features:
- Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini,
- Silicone non-slip foot pads, a specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid, and anti-scald so that the tin planting position is more stable
- Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge iPhone 13/13Pro /13Pro Max /13Mini
Package includes:
- 1 x 4-in-1 Middle frame reballing platform
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