Kaisi 818 Adjustable Temperature Heating Station for BGA Rework / Cellphone Frame Disassemble

Kaisi 818 Adjustable Temperature Heating Station for BGA Rework /Cellphone Frame Disassemble

Features:

• Automatic heating of metal plate, the adjustable temperature is 50-450°C

• Internal safety power supply system to avoid leakage problems

• Super thick metal panel, even heating

• LED display, temperature information is clear at a glance

• Application scope: LED lamp bead PCB disassembly, chemical experiment, chip disassembly, mold core preheating, electrical chip preheating, etc

Specification:

• Power: 260W

• Temperature control range: 50-450℃

• Input: AC 220V/110V 50/60Hz

• Package Weight: about 1600g

• Product size: about 13cm * 13cm * 13cm

• Heating plate size: about 10cm*10cm

Package includes:

• 1 x Heating platform

• 1 x Packing box

• 1 x Power cable

Notes:

• The heating plate is very hot when the partition is working, please pay attention

• Please pay attention to the items you want to heat: the too high temperature will damage the items

• After turning off the heating platform and cooling down, you can move or touch the heating platform

• Please turn off the power of the heating platform when not in use