Kaisi SWA15 1.5M High-Quality BGA Desoldering Soldering Sucking Line for Mobile Phone Repair
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Seller: Martview Shenzhen
ID: MV-220720X262C6
Weight: 0.01 kg
| Qty | Price | Discount |
|---|---|---|
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| 3 | NaN | -3.1% |
| 5 | NaN | -4.6% |
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Product details
Description
Kaisi SWA15 1.5M High-Quality BGA Desoldering Soldering Sucking Line for Mobile Phone Repair
Features:
- Oxidation resistance/Anti-corrosion/Fast to Tin
- No cleaning/Low residue/Strong cleaning
- Strong desoldering, strong cleaning
- High-quality desoldering wicks
- Suitable for various electronic circuit PCB circuit boards
- Weaving process, soft design
- The surface tension is large, which reduces the damage to the circuit board, the heat conduction is fast, the tin is fast, and the performance is good
- High-quality material, real material
- Various wire diameters, free choice according to your needs
Package includes:
- 1 x Soldering sucking line
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