Lanrui C4 Explosion-Proof Gasket for Mid-Layer Bonding in Apple / Android Phone Motherboard Repair
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Seller: Martview Shenzhen
ID: MV-260610KBQWXB
Weight: 0.03 kg
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Description
Lanrui C4 Explosion-Proof Gasket for Mid-Layer Bonding in Apple / Android Phone Motherboard Repair
Features:
- Lanrui C4 Explosion-proof Gasket, Not afraid of strong compression, Explosion-proof tin, Anti-deformation
- Phosphor-copper material offers better electrical performance: The gasket is made of phosphor copper material, featuring low electrical loss,high electrical efficiency, excellent fatigue resistance stable operation and long-lasting performance without any compromise
- Small size, big impact: The "pillar"of precision electronic hardware,unafraid of intense compression, explosion-proof soldering, and deformation prevention
- High-quality phosphorus copper: Low conductive loss, high efficiency, fatigue resistance
- Product Usage: When the main board is deformed, the middle layer of the main board does not fit well. Pressing it will
- cause solder to burst out. By placing a spacer pad on top and then pressing again, it is less likely for the solder to burst out. It is used as an auxiliary for fitting
Simple operation:
- Implant the tin paste using the tin-coated steel mesh
- Place the gasket at the required position
- Melt the solder paste on the solder pad and fix the chip for immediate use
Package includes:
- 1 x Gasket
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