LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 11-17PM

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Seller: Martview Shenzhen

ID: MV-26093075TC2C

Weight: 0.55 kg

Qty	Price	Discount
1	NaN
3	NaN	-3.1%
5	NaN	-5.4%
10	NaN Wholesale Price	-8.5%

Please select Type

for iPhone 11 to 12PM/without Base

for iPhone 13 Series/without Base

for iPhone 14 Series/without Base

for iPhone 15 Series/without Base

for iPhone 16 Series/without Base

for iPhone 17 Series/without Base

Full Set/for iPhone 11 to 17PM/with Base

Product details

LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 11-17PM

Features:
Supports iPhone 11-17 Series, synthetic stone material; Corrosion-resistant and anti-static
Multi-directional strong magnetic adsorption: The base features a built-in powerful magnet ensuring strong magnetic adhesion, precise positioning, and zero deviation
11-17 Series Mid-Layer Tinning Station: Heat Dissipation Vents + Precision Alignment, Tin Planting-Flawless in a Single Step
High Precision, Precise Positioning, Ensure Accuracy, Minimize Error
Premium Steel. Precision Crafted: Crafted from carefully selected, high-quality steel, the mesh offers excellent resilience and exceptional durability

Package includes:
According to your choice