LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 18 Series
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Seller: Martview Shenzhen
ID: MV-261020YA9V72
Weight: 0.10 kg
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| 3 | NaN | -2.9% |
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only F20 Max Basefor iPhone 18 Series/without BaseProduct details
Description
LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 18 Series
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