LB Tool Hand-Polished Blades for Mobile Phone Prying / Degumming / Motherboard Delamination

LB Tool Hand-Polished Blades for Mobile Phone Prying / Degumming / Motherboard Delamination

Features:

• Hand-Polished Blades: Meticulously crafted for superior sharpness and precision

• Premium Alloy Material: High hardness, strong toughness, and resistance to deformation

• Temperature Resistance: Withstands temperatures from -20°C to 450°C, ensuring reliability under intense conditions

• Corrosion-Resistant: Engineered for longevity even in harsh environments

• Versatile Designs: Multiple blade types (I, II, III, IV, V) tailored for specific repair scenarios

Blade Models & Functions:

• Model I (Straight Cutter): Pry the IC CPU to remove the glue

• Model II (Corner Blade): Ideal for scraping adhesive around IC edges.

• Model III (Special-Shaped Cutting Blade): Designed for precise glue cutting in complex areas.

• Model IV (Straight Cutter): Pry CPU and layer it

• Model V (Prying Blade): Perfect for lifting ICs and hard drives without damage.

Applications:

• Cutting black glue and edge adhesive

• Removing glue from motherboard ICs/CPUs

• Prying out CPUs, ICs, and hard drives with precision

Package includes:

• 3 x Blades