Low Temperature Demolition Welding Platform for iPhone A8 A9 – Precision Repair Tool for Safe Component Removal

Temperature Setting Parameters
Summary: All temperatures are adjustable between 180 °C and 240 °C depending on the operation.

• Demolition shield: 180 °C – 200 °C
• Plastic (CPU side): 180 °C – 200 °C
• A8/A9 CPU removal: 230 °C – 240 °C
• Glue removal: 180 °C – 200 °C
• Tin planting: 180 °C – 200 °C
• A8/A9 CPU welding: 190 °C – 210 °C

Steps for Usage
1. Power on the device and set the required temperature.
2. Position the motherboard and secure it in place.
3. Pre‑heat for 1 minute.
4. After pre‑heating, detach the CPU.
5. Perform surrounding cuts, then use a pry tool to lift the CPU.
6. Set the removed CPU aside for the next operation.
7. Adjust temperature to 180 °C and scrape the CPU socket.
8. Remove the motherboard, install the new CPU, keep the temperature at 180 °C, and scrape as needed.