Low Temperature Demolition Welding Platform for iPhone A8 A9
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Product details
Description
Temperature setting parameters
- Demolition shield temperature adjustment 180 ℃ -200 ℃
- In addition to the CPU side of the plastic temperature adjusted to 180 ℃ -200 ℃
- Demolition of A8A9CPU temperature to 230 ℃ -240 ℃
- Remove the glue temperature to 180 ℃ -200 ℃
- Planting tin temperature adjustment to 180 ℃ -200 ℃
- Welding A8A9CPU temperature to 190 ℃ -210 ℃
Steps for usage
1. Turn on and adjust the temperature
2. Adjust the motherboard position and fix it
3. Preheat for 1 minute
4. Done preheat then disassemble the CPU
5. After the surrounding cutting, take the pry chip to remove the CPU
6. Place the disassembled CPU aside for the next step
7. Adjust the temperature to 180 ° C and scrape the CPU slot
8. Remove the motherboard, replace the CPU, adjust to 180 ° C, then scraping
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