Luowei HS3-PRO Motherboard Layered BGA Soldering Rework Station for iPhone X to 16 Pro Max
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Seller: Martview Shenzhen
ID: MV-251113Z5PF78
Weight: 0.10 kg
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| 3 | NaN | -3.1% |
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Description
Luowei HS3-PRO Motherboard Layered BGA Soldering Rework Station for iPhone X to 16 Pro Max
Features:
- Expansion modules undergo continuous upgrades, and models
- are constantly updated. A single purchase ensures long-term usability
- The heating platform adopts high-efficiency heating elements and heat-conducting materials, ensuring that it can quickly heat up in only 1 minute
- Hole alignment precise positioning, zero-error calibration, no wobble, every operation is precise and controllable
- High precision accurate positioning, high-precision equipment manufacturing, with errors close to zero, improving maintenance efficiency
Package includes:
- According to your choice
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