MaAnt 0.12mm Middle Layer BGA Reballing Stencils for Huawei Mobile Phones
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Seller: Martview Shenzhen
ID: MV-23020895V92K
Weight: 0.01 kg
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Full Set/16PcsProduct details
Description
MaAnt 0.12mm Middle Layer BGA Reballing Stencils for Huawei Mobile Phones
Features:
- Each mesh is checked according to the original drawing to ensure that each
- There should be no fewer solder joints, which are completely consistent and accurately aligned
- Keep the flexibility of steel for a long time, with normal deformation and bending, it's easy to restore it immediately
- Imported alloy steel with good high-temperature resistance and metal fatigue resistance, making the service life of the product more lasting
- Square hole chamfered tin planting black net makes every tin ball of you, more round and full, no solder bal
- It has higher toughness and high-temperature resistance than ordinary steel
Package includes:
- 1 x Stencil
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