MaAnt Magnetic Power C1 Absorption Positioning Tin Planting Platform Set for Apple / HiSilicon / Qualcomm Snapdragon Series CPU

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Seller: Martview Shenzhen

ID: MV-220412Y76B76

Weight: 0.14 kg

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3	NaN	-3.1%
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10	NaN Wholesale Price	-8.5%

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Base + Full Set Stencil/61Pcs

for EMMC RAM BGA Stencil Set/7Pcs

for MediaTek Stencil Set/10Pcs

for HiSilicon Qualcomm RAM Stencil Set/7Pcs

for Apple A8-A17 Stencil Set/10Pcs

for HiSilicon Stencil Set/9Pcs

for Snapdragon Stencil Set/11Pcs

only C1 Base

for Samsung Stencil Set/7Pcs

Product details

MaAnt Magnetic Power C1 Absorption Positioning Tin Planting Platform Set for Apple/HiSilicon/Qualcomm Snapdragon Series CPU

Features:
Automatic precise positioning
The new magnetic dynamic original positioning
Strong magnetic force automatic clamping

Installation Method:
Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)