Maples PPD 120XL Heater Mini Intelligent Remove Welding Platform – Desoldering, Demolition & Rework Station for iPhone X Upper / Lower Logic Board, CPU, NAND IC
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Seller: Martview Shenzhen
ID: MV-103624
Weight: 1.00 kg
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Product details
Description
Maples PPD‑120XL Mini Intelligent Desoldering & Rework Station – iPhone X Logic Board (Upper/Lower) CPU & NAND IC
Key Benefits
• Fast, precise removal of welding without a hot‑air rework station
• Operates up to 240 °C for efficient A11 CPU demolition
• Ideal for iPhone X logic board repair – upper & lower boards, CPU, NAND, BGA chips
Temperature Settings (°C)
- Demolition shield: 180 – 220
- CPU side glue: 180 – 220
- A11 CPU demolition: 230 – 240
- Desmearing: 180 – 200
- Reball BGA chip: 180 – 200
- Soldering A11 CPU: 190 – 210
Package Includes
1 × Maples PPD‑120XL Mini Intelligent Desoldering & Rework Platform
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