Maples PPD 120XL Heater Mini Intelligent Remove Welding Platform Desoldering Demolition Rework Station for iPhone X Upper / Lower Logic Board CPU NAND IC

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Seller: Martview Shenzhen
ID: MV-103624
Weight: 1.00 kg
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Description
Maples PPD 120XL Heater Mini Intelligent Remove Welding Platform Desoldering Demolition Rework Station for iPhone X Upper / Lower Logic Board CPU NAND IC . No need the hot Air Rework station, working on 230℃, professional tool for repair iPhone X logic board in fast and efficient method
Temperature setting parameters:
- Demolition shield temperature adjustment 180℃-220℃
- In addition to CPU side glue temperature 180℃-220℃
- Demolition A11 CPU the temperature 230℃-240℃
- Desmearing temperature 180℃-200℃
- Reball BGA chip temperature 180℃-200℃
- Soldering A11 CPU temperature 190℃-210℃
Package include:
1 x Maples PPD 120XL Mini Intelligent Remove Welding Platform







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