Mechanic 3D Middle Layer Motherboard Double-sided Reballing Stencil for iPhone 12 Full Series

Mechanic 3D Middle Layer Motherboard Double-sided Reballing Stencil for iPhone 12 Full Series

Features:

• Embedded 3D half-engraved step process, the thickness of the composite material is 0.3mm, the thickness of the groove half-engraved is 0.15mm, and the thickness of the ball is 0.15mm

• It can be removed from the net and planted with tin, which can effectively prevent the steel mesh from bulging.

• Square hole tin planting mesh, precise mesh alignment, close fit, no offset, accuracy up to ±0.003mm

• The solder joints are round and full like pearls, and the tin is removed from the net. The solder balls are bright and full, and the balls are evenly formed.

• Good toughness, strong hardness, high-temperature resistance of 585 ℃, no bulging, high flatness, not easy to deform

• Double-sided positioning structure design, positioning tin planting, and glue removal on the upper and lower layers of the motherboard

Package includes:

• 1 x Stencil