Mechanic BGA IC Adhesive Glue Remove Liquid Tool

Mechanic BGA IC Adhesive Glue Remove Liquid Tool

Feature:

• 20ml BGA IC glue epoxy remover.

• Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.

• Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.

• It won't do harm to your circuit board and components.

• Environment friendly and safe. Doesn't contain any Benzene Coderivative substances with cause leukemia.

• Convenient to use

​How to Use:

1. Pick a bigger size absorbent cotton than BGA IC with tweezers and dip into the removing liquid. Then cover it evenly on the BGA IC chip which in need of glue removing.
2. Place a plastic bag or film on the top and cover the PCB board.
3. Wait for about 20 minutes.
4. Redo step 1 to step 3.
5. To remove the softened sealing glue in the outside of BGA IC chip with tweezers. Please pay attention to avoid damaging routes surrounding BGA and copper foil circuits around the mainboard when removing the glue.
6. Heat up the chip with an air tool (300 deg.C). The glue in the bottom will get melt and soften by heat.
7. To remove the chip with a tweezers or cutter

Package includes:
1 x Mechanic BGA IC Adhesive Glue Remove Liquid

NOTE:
This is a liquid spray product. Can ONLY ship within China address.

Please provide China address to order, thanks