MECHANIC C9 High-Quality CPU Removal & Welding Heating Platform for iPhone A8 / A9 / A10

Mechanic C9 High‑Quality CPU Removal & Welding Heating Platform
Compatible with iPhone A8, A9, A10 – ideal for motherboard chip removal, glue cleaning, and re‑balling with precise temperature control.

Key Features:

• Intelligent Pre‑Heating: Rapidly reaches the set temperature for efficient work.
• Adjustable Temperature Zones:
    • Shielding cover removal – 180 °C ~ 200 °C
    • CPU edge glue removal – 180 °C ~ 200 °C
    • A8/A9/A10 CPU removal – 230 °C ~ 240 °C
    • General glue removal – 180 °C ~ 200 °C
    • Chip re‑balling – 180 °C ~ 200 °C
• Free‑Fix Positioning Buckle: Securely holds the iPhone mainboard for hands‑free operation.
• Multi‑Purpose: Removes chips, cleans glue, and prepares boards for re‑balling.

• 1 × C9 Welding Heating Platform (soldering iron not included)