Mechanic Dusty LA-03 Anti-Blowout BGA Reballing Pad for CPU IC Chip Soldering Repair
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Seller: Martview Shenzhen
ID: MV-251231G882T9
Weight: 0.15 kg
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Description
Mechanic Dusty LA-03 Anti-Blowout BGA Reballing Pad for CPU IC Chip Soldering Repair
Features:
- Heat & Oxidation Resistant: Withstands high temperatures during reballing, preventing oxidation and ensuring reliable performance
- Anti-Blowout Design: Effectively stops solder balls from popping up, keeping the workspace clean and repairs precise
- No Warping Guarantee: Maintains a flat surface under heat, avoiding steel mesh bulging that causes tin ball bursts
- Transparent Visibility: Crystal-clear material lets you monitor BGA chips and solder placement in real time
- Multi-Chip Compatibility: Works with phone motherboards, graphics cards, laptop chips, and other electronic devices
- Efficiency Boost: Simplifies complex repairs, significantly speeding up reballing and soldering processes
- Durable White Glass Build: High-quality material ensures long-term use without deformation
Package includes:
- 1 x BGA Reballing Pad
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