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Mechanic Heat-mini IC Chip Glue Removal Station for Chip IC Glue Removing & Planting Tin

mechanic heat-mini-ic-chip-glue-removal-station-for-chip-ic-glue-removing-planting-tin-1
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ID: MV-2605237Z1P7T
Weight: 0.20 kg
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Product details

Description

Mechanic Heat-mini IC Chip Glue Removal Station for Chip IC Glue Removing & Planting Tin

Features:
  • Intelligent one-touch heating utilises a professional temperature ramping algorithm with factory-calibrated temperature control curves, effectively preventing thermal stress damage to chips for greater peace of mind
  • Supports continuously adjustable temperatures from 160°C to 250°C with stable temperature control, meeting the requirements for adhesive and solder removal on all types of chips
  • No need for a heat gun or soldering iron. Once the desoldering station is heated to the set temperature, simply wipe with a Repair Master brush to easily remove adhesive
  • Concealed telescopic screw design, durable and easy to clean, with flexible extension and clamping
  • Fully concealed screw structure prevents debris from entering, ensuring no jamming or dirt accumulation for a longer service life
  • 18×21mm micro-work area precisely focuses heat on the chip body, minimising temperature fluctuations to ensure the adhesive removal process does not burn the board or damage the pads
  • Exceptional versatility with an extremely wide range of compatibility, supporting 99% of chip, hard drive and CPU adhesive and solder removal tasks on the market – a single machine with multiple uses

Package includes:
  • 1 x Glue Removal Station
  • 1 x Type-C
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mechanic heat-mini-ic-chip-glue-removal-station-for-chip-ic-glue-removing-planting-tin-7
mechanic heat-mini-ic-chip-glue-removal-station-for-chip-ic-glue-removing-planting-tin-8

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